Datacon 2200 Evo Manual Pdf !!install!!
The Besi Datacon 2200 evo stands out as an exceptionally versatile multi-chip die bonder designed for high-precision semiconductor assembly. This highly adaptable machine combines both die attach and flip chip capabilities within a unified manufacturing platform. Operating this equipment effectively requires a detailed mastery of its mechanics, software interfaces, and maintenance protocols outlined in the official technical documentation. The comprehensive operational manual can be accessed directly through the Besi Customer Area or referenced via standardized interface documentation such as the Scribd Datacon 2200 SECS/GEM Manual . Core Hardware Architecture The platform architecture relies on advanced sub-systems designed to balance speed, precision, and structural stability across continuous manufacturing shifts. +-------------------------------------------------------------+ | Datacon 2200 evo Main Platform | +------------------------------+------------------------------+ | +-----------------------+-----------------------+ | | +------v-----------------------+ +-------v----------------------+ | Gantry & Motion | | Material Handling | | • Linear motor positioning | | • 50mm to 300mm wafers | | • Real-time thermal comp. | | • Substrate boats & carriers| +------------------------------+ +------------------------------+ | +-----------------------+-----------------------+ | | +------v-----------------------+ +-------v----------------------+ | Bond Head Unit | | Dispensing Systems | | • 7 to 14 automatic tools | | • Time/Pressure & Jetter | | • Hot/cold curing support | | • Multi-viscosity epoxies | +------------------------------+ +------------------------------+ Gantry System: Driven by high-speed linear motors that offer rapid acceleration while minimizing structural vibrations. Vision System: Outfitted with high-resolution digital cameras and programmable lighting arrays. It evaluates gray levels, edges, and ink dots for precise alignment. Thermal Compensation: Uses active sensors linked to real-time algorithms. It self-corrects for machine drift caused by internal or ambient temperature fluctuations. Bond Head & Tooling: Contains an automatic tool changer holding 7 to 14 custom pick-and-place tips. It manages a force spectrum ranging from delicate touches to high-force applications. Machine Specifications Overview The distinct operational performance levels across the Besi Datacon 2200 evo Product Portfolio are outlined below: Datacon 2200 evo - Product details | Besi
Since I cannot directly provide a downloadable PDF file, I have compiled a comprehensive "Quick-Start & Reference Guide" based on the standard technical specifications and operational procedures for this specific model. This piece is designed to function as a surrogate manual for operators and maintenance technicians.
Datacon 2200 EVO: Operation & Reference Manual Document Reference: D2200-EVO-OP-0823 1. System Overview The Datacon 2200 EVO is a fully automatic, high-speed die bonder designed for high-mix, small-batch production environments. It utilizes a vision-based placement system to handle various die sizes (from small image sensors to larger power devices) with sub-micron placement accuracy. Key Applications:
Optoelectronics (LED, VCSEL, Photo-diodes). Image Sensors (CIS stacking). MEMS and Sensor packaging. datacon 2200 evo manual pdf
2. Technical Specifications | Parameter | Specification | | :--- | :--- | | Placement Accuracy | ± 2.5 µm @ 3 Sigma (Standard) | | Throughput | Up to 4,500 UPH (dependent on application) | | Die Size Range | 0.1 mm² up to 25 mm² | | Bonding Methods | Epoxy, Eutectic, Solder Reflow, UV-Cure | | Wafer Size | 2" to 8" (Standard) | | Substrate Size | Up to 140 mm x 200 mm (Strip or Single) | | Motion System | Gantry style with linear servo motors | | Vision System | Dual-camera system (Die & Substrate) with Pattern Recognition (PR) | 3. Machine Components & Layout
Input/Output Stations: Motorized trays or magazine loaders for substrates and wafers. Wafer Handling Module: Automated wafer ring mounting, tape frame handling, and wafer mapping. Bond Head Assembly: The Z-axis mechanism equipped with a collet (pick-up tool) and force sensor. Dispensing Unit: Time-pressure or Auger pump for adhesive application (located usually at the XY-stage). Vision System: Top-side cameras for alignment and a wafer look-up camera.
4. Pre-Operation Checklist (Start-Up) Before initiating a production run, perform the following safety and hardware checks: The Besi Datacon 2200 evo stands out as
Pneumatic Pressure: Ensure the main air supply is connected and reading 6.0 bar (87 psi) . Emergency Stop: Verify the E-Stop buttons (on the main control panel and handheld pendant) are released. Collet Inspection: Check the pick-up tool (collet) for wear or debris. A damaged collet is the primary cause of placement inaccuracy. Epoxy/Paste Check: Verify the reservoir level in the dispensing unit. Prime the nozzle if the machine has been idle for >4 hours.
5. Loading the Recipe (Software Interface) The EVO is controlled via a Windows-based Graphical User Interface (GUI).
Login: Enter Operator credentials on the touch screen. Recipe Select: Navigate to the Recipe Management tab. Load: Select the specific job file (e.g., JOB_CIS_02.rcp ) and click Load . Verification: The machine will perform a homing sequence. Ensure the "Status" bar displays READY (Green) . 6. Calibration &
6. Calibration & "Teaching" Procedures If the machine drifts, or a new product is introduced, the following calibration steps are required: A. Calibration Plate Alignment
Place the calibration plate on the XY stage. Run the Stage Alignment utility. The machine will use the vision system to find alignment marks on the plate. Adjust the stage offsets until the crosshairs align with the calibration marks on the screen.